Introduction to SMT Factory
The company provides a one-stop solution from components to PCBA. At present, the company has 4 Japanese YAMAHA-YS series automatic SMT lines and 1 wave soldering line. The mounting line has the ability to mount 0201 (CHIP parts) and 0.4MM spacing BGA (CHIPSET), as well as industrial control boards
Wave soldering capability. Provide the fastest 12 hour delivery service. The company has introduced an advanced automatic first article inspection system to safeguard quality;
Daily maximum production capacity: SMT * 6 million DIP * 400000 TEST * 5K
(Calculated based on tablet products) The company has a management team with decades of industry experience, committed to building a leading manufacturer of high-precision PCBA in Shenzhen and even the country;
SMT quotation needs to be provided：
1. Complete SMT files (Gerber files, tag maps, coordinate files, steel mesh files) and special requirements for SMT processing;
2. Complete BOM (including model, tag number, packaging, description, usage, etc.);
PS: The cost of functional testing needs to be reported, and the method of functional testing needs to be provided.
Processing capacity
There are 4 SMT SMT SMT production lines, equipped with high-end equipment such as Yamaha fully automatic SMT production line, fully automatic solder paste printing machine, eight temperature zone, ten temperature zone reflux furnace, AOI, and integrated SMT machine. The chip production capacity is 6 million solder points/day, and the maximum daily production capacity of wave soldering processing is 500000 points. Capable of installing BGA layouts with a spacing of 01005 and 0.40mm, as well as computer motherboard wave soldering capabilities.
| SMT production capacity |
6 million solder joints/day |
| SMT production line |
4 patch lines and 1 wave soldering line |
| Throwing rate |
Resistance and capacitance class 0.3% (0201, 0402:0.5%, excluding large parts) |
|
IC without throwing material |
| Single board type |
Ordinary circuit board, FPC board, rigid flexible combination board |
| Chip Component Specifications |
Minimal packaging that can be pasted |
01005 Chip/0.4 Pitch BGA |
|
Minimum component accuracy |
±0.04mm |
|
IC chip placement accuracy |
±0.03mm |
| Chip PCB specifications |
PCB Size |
50*50mm - 774*710mm |
|
PCB Thickness |
0.3-6.5mm |
SMT chip processing process
